DIMA Modulo MP-200 Pick en Place

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DIMA Modulo MP-200 Pick en Place in goede conditie.

Features:

  • Modular built for growth
  • 120 8/12mm feeder positions in-line or 180 feeders off-line
  • Standard with full vision alignment (no laser alignment)
  • No feeder reduction for 12 mm feeder h Quadruple Placement Head (for 4 nozzles)
  • 9000 CPH (IPC rated)
  • 12000 CPH (tact time)
  • Intelligent feeders
  • Dimasoft® one key operation software
  • Linear encoders with 0.001 mm resolution
  • Easy width adjust pass-through conveyor
  • Off-line programming and optimization h In-line or off-line available

Specificaties:

Type

Pick and Place machine

Dimension off-line (L x W x H)

2150 x 1700 x 1500 mm (+500 mm for signal light)

Dimension in-line (L x W x H)

1750 x 1300 x 1500 mm (+500 mm for signal light)

Board thickness

min. 0.5 mm - max. 3.2 mm thick

Board size

min. 30 x 30 mm - max. 380 x 500 mm (off-line) max. 310 x 510 mm (in-line)
Optional extention up to: 550 x 950 mm.

Maximum Warpage

0.5 mm up - 1 mm down

Component Height

In fly max. 10 mm - bottom max. 20 mm

Placement Accuracy

16.7 µm @ 1σ
50 µm @ 3σ, using 1 µm encoders

Placement Rate

9000 cph (IPC rated) - quadruple placement head 12.000 cph (tact time) - quadruple placement head

Components

Chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA, etc. smallest pitch 0.3 mm (with second camera)

Component size

0201 up to QFP208, field of view 50 x 50 mm. Optional size: 01005

Motion

X and Y, AC/DC servo motors with linear encoder and digital motion controller.

Increment Axis

X: 0.001 mm, Y: 0.001 mm, Z 0.02 mm, Theta: 0.045 degr.

Control

Integrated microprocessor controller with CAN interface combined with PC running on Windows® 7

Interface

Fully SMEMA compatible as option: MP-1290, Conveyer height 865 to 970 mm.

Feeder Characteristics

Intelligent feeders, in-line 30 expandable to 120 8 or 12 mm tape feeders, off-line 30 expandable to 180 8 or 12 mm tape feeders, Number of trays depending on PCB size, tape feeders from 8 to 44 mm, plastic stick up to 50 mm wide, tray 335 x 185 mm for tape sequencer

Vision System

ESI Correctplace®, Automatic board alignment - full vision component alignment and analysis by vision system. Test on lead pitch, sqew angle, BGA bal size and number of balls.

Cameras

1 Fiducial and 5 component alignment cameras with CMOS chip

Power Requirement

220 Vac / 50 - 60Hz / 2500 Watt

Air Requirement

6.5 - 7 Bar / 100 L/Min.

Operating Temperature

15 - 30º Celsius

Noise Level

Noise emission during operation < 70 dB(A)

Weight

700kg without feeders, 950kg with feeders

 

Voor meer informatie, neem contact met ons op.

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