Interselect IS-T-300S
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Interselect IS-T-300S Selective solder machine in excellent condition
VIntage 2014
Description:
The system IS-T-300 offers proven InterSelect technology and quality from Germany for entry into selective soldering on an extremely economic base. This is the challenge we’re facing with a radical design change which also results in smaller footprint requirements (~1m²) of the machine. Special care was taken that process-quality-related modules from the high-end Inline systems such as solder pot, MicroDrop Fluxer and axis system could be used in this small system. The integrated Windows 7 PC runs the familiar, user-friendly Software. Additionally the system already includes one of the best offline solder programming software, the IS-PhotoScan. The IS-T-300 has a soldering area from 300x300mm and is able to process PCBs up to 300x500 mm at the same speed (200mm/s) like machines with way greater demands on the budget. The ability for remote maintenance reduces service times dramatically so the customer saves a lot of time and service costs.
Features:
Process-Camera - The live video of the process camera, which shows the nozzle and the soldering process, is displayed on an additional monitor. By viewing the video the solder wave can be constantly observed by the user - including the whole soldering process. This allows the technician or engineer to adjust the soldering program and important parameters and to observe the result directly on the monitor.
Wave height control and automatic correction - By using a laser sensor the height of the solder wave is monitored – and if necessary automatically corrected to the pre-set wave height.
Solder Level-Sensor - A floater which is monitored by a laser sensor checks on the solder level. When the solder level drops beyond a predetermined level the system displays a message right in the machine’s software.
Pump-System - In order to equalize the flow behavior of the solder in the pump channel and to keep it free of fluctuations this all-titanium pump was constructed in a special procedure. A particularly quiet, turbulent-free solder wave is the result.
Pull-Off Feature to avoid Shorts - Especially when soldering connector strips, or other components where multiple pins can be soldered in a line, shorts can be formed between the last two pins. Excess solder from the last pin cannot be dragged to another pin and forms a bulbous solder joint, or worse: a bridge to the nearby pin. To remove this excess solder the InterSelect systems provide a "pull-off" solution. Before the solder wave is moved away from the solder joint, the machine reduces the pump power abruptly. Due to the rapid collapse of the solder wave, excess solder is withdrawn from the pin and only the required amount of solder remains at solder joint.
Wettable-Nozzles - For the wettable nozzles the solder is running in all directions, i.e. all around the nozzle. Solder nozzles from InterSelect are made from a specially developed metal alloy which have high and persistent resistance even for lead-free solder alloys. A specially designed nozzle body reduces the formation of dross (solder slag) by more than 90% and avoids solder balls on the PCB bottom side far better than conventional nozzle designs.
Automatic Nozzle-Cleaning - Only a clean and oxidation-free solder nozzle can be wettable. With the integrated cleaning station the InterSelect cleaner is automatically sprayed onto the nozzle and oxidation residues are removed.
Specifications:
| Footprint | 1165 X 1030 x 1200 mm (LxWxH) |
| PCB holder | Lenght min-max: 5-500mm width min-max: 5-300mm Components above: up to 120mm components below: up to 40mm |
| Energy requirements | 1 x 230 V 1,3 m3/h N2 @ 99.99% purity No compressed air Required |
| Preheating | Nitrogen heating IR heater from 1.5 up to 4.5KW |
| Solder pot | 12KG Pump unit made of titanium Pot made of titanium |
| Specification | Description |
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| Disclaimer | 0 |
