Seamark ZM R8650C BGA Rework Station
Precise Visual Alignment
Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high- definition industrial camera system is for accurate measurement and positioning of the chip, the automatic vision software system automatically corrects the angle, and the image is displayed in HD.
ESD lonizer
Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.
Precise Motion Platform
It adopts industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently. It adopts a grinding marble platform and a precise grinding screw. The visual accuracy can reach ± 0.01mm.
Multifunctional Control Feature
The self-developed software realizes fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and it can automatically generate record files to achieve traceability of historical parameters.
The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics, and there are Chinese and English interfaces to choose.
Three Independently Programmable Heating Zones
Three heating zones independently programmed and controlled; convection hot air heating in the top heater and the bottom, the heater adopts a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported medium wave ceramic infrared heating Plate heating. The area can reach 645×524mm.
Stable Temperature Control
High-precision K-type thermocouple with accuracy up to ± 1 ℃, dynamic PID multi- loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.
Bottom Heating System
The bottom preheating adopts the heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.
| Model | R8650C |
|---|---|
| Power Supply | AC380V±10% 50/60Hz |
| Power | Total power 22KW Upper temperature zone(2KW) Lower temperature zone(2KW) Other power(1.8KW) Preheating temperature zone(16KW) |
| PCB Size | 660x600mm(Max) ; 10×10mm(Min) |
| BGA Chip Size | 100×100mm(Max) ; 1×1mm(Min) |
| IR Temp. Zone Size | 640×520mm |
| Motion Control | X/Y/Z |
| External Temp. Sensor | 8PCS |
| Control System | Industrial PC+Servo motion control system |
| Display System | 24＂SD display |
| Alignment System | ZM pixels visual alignment system |
| Vacuum adsorption | Full automatic |
| Alignment Accuracy | ±0.025mm |
| Temp. Control | K-type thermocouple(closed-loop), intelligent temperature compensation system with accuracy up to ±1℃ |
| Feeding Device | Semi-automatic |
| Positioning | V-groove with universal fixture(shaped fixture can be customized |
| Dimensions | L1235×W1215×H1850mm |
| Weight | 993.5KG |
