Seamark X6600 X-ray Inspection
X6600 X-Ray Inspection System:
- SMT/Semicon/Solar/Connector/LED
- High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
- 90KV 5μm closed X-ray tube, with long life, maintenance in free
- 1.3 million high resolution digital flat panel detector
- 30 degrees observation
- Color image navigation, easy to use
- Automatic programming detection and automatic analysis NG or OK
- More modular panels observation point setting
Application
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder shorts, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection, etc.
| Model | X6600 | |
| X-RAY Source | Tube type | Reflective Sealed micro-focus X-ray Source |
| Tube Voltage | 90KV/130KV (optional) | |
| Operating Voltage | 40-90KV/130kv | |
| Operating Current | 10-200µA/300µA | |
| Maximum Output Power | 8W/39W | |
| Micro Focus Size | 5µm-15µm | |
| Flat Panel Detector | Flat Panel Type | Amorphous silicon flat panel detector (optional) |
| Pixel Matrix | 1536×1536 | |
| Field of View | 130mm×130mm | |
| Resolution | 5.8Lp/mm | |
| Image Frame Rate(1×1) | 20fps | |
| AD Conversion Digits | 16bits | |
| Radiation Safety | X-ray Leakage | <1µSv/h |
| Equipment Performance | Stage Size | 540mm×440mm |
| Loading Capacity of Stage | ≤5Kg | |
| Max Tilt Angle | 65 degree | |
| Equipment Specification | Dimensions | L1360×W1240×H1700mm |
| Net Weight | About 1170KG | |
| Input Power | 220V 10A/110V 15A 50-60Hz |
