DIMA Modulo MP-200 Pick and place
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DIMA Modulo MP-200 Pick and Place in good condition.
Features:
- Modular built for growth
- 120 8/12mm feeder positions in-line or 180 feeders off-line
- Standard with full vision alignment (no laser alignment)
- No feeder reduction for 12 mm feeder h Quadruple Placement Head (for 4 nozzles)
- 9000 CPH (IPC rated)
- 12000 CPH (tact time)
- Intelligent feeders
- Dimasoft® one key operation software
- Linear encoders with 0.001 mm resolution
- Easy width adjust pass-through conveyor
- Off-line programming and optimization h In-line or off-line available
Specifications:
Type | Pick and Place machine |
Dimension off-line (L x W x H) | 2150 x 1700 x 1500 mm (+500 mm for signal light) |
Dimension in-line (L x W x H) | 1750 x 1300 x 1500 mm (+500 mm for signal light) |
Board thickness | min. 0.5 mm - max. 3.2 mm thick |
Board size | min. 30 x 30 mm - max. 380 x 500 mm (off-line) max. 310 x 510 mm (in-line) |
Maximum Warpage | 0.5 mm up - 1 mm down |
Component Height | In fly max. 10 mm - bottom max. 20 mm |
Placement Accuracy | 16.7 µm @ 1σ |
Placement Rate | 9000 cph (IPC rated) - quadruple placement head 12.000 cph (tact time) - quadruple placement head |
Components | Chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA, etc. smallest pitch 0.3 mm (with second camera) |
Component size | 0201 up to QFP208, field of view 50 x 50 mm. Optional size: 01005 |
Motion | X and Y, AC/DC servo motors with linear encoder and digital motion controller. |
Increment Axis | X: 0.001 mm, Y: 0.001 mm, Z 0.02 mm, Theta: 0.045 degr. |
Control | Integrated microprocessor controller with CAN interface combined with PC running on Windows® 7 |
Interface | Fully SMEMA compatible as option: MP-1290, Conveyer height 865 to 970 mm. |
Feeder Characteristics | Intelligent feeders, in-line 30 expandable to 120 8 or 12 mm tape feeders, off-line 30 expandable to 180 8 or 12 mm tape feeders, Number of trays depending on PCB size, tape feeders from 8 to 44 mm, plastic stick up to 50 mm wide, tray 335 x 185 mm for tape sequencer |
Vision System | ESI Correctplace®, Automatic board alignment - full vision component alignment and analysis by vision system. Test on lead pitch, sqew angle, BGA bal size and number of balls. |
Cameras | 1 Fiducial and 5 component alignment cameras with CMOS chip |
Power Requirement | 220 Vac / 50 - 60Hz / 2500 Watt |
Air Requirement | 6.5 - 7 Bar / 100 L/Min. |
Operating Temperature | 15 - 30º Celsius |
Noise Level | Noise emission during operation < 70 dB(A) |
Weight | 700kg without feeders, 950kg with feeders |
Please do not hesitate to contact us for any further information.
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