Mirtec MV-3L AOI
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Mirtec MV-3L AOI in excellent condition.
Inspection Performance
- Advanced 5 or 10 Mega Pixel Digital Colour Camera Technology yields unsurpassed defect detection, a minimum false call rate, and lightening fast PCB Inspection: up to 173 cm²/sec. Inspection performance which surpasses that of competitive Inline machines
- MIRTEC's innovative Quad Angle Lighting System provides enhanced solder joint and solder bridge inspection capability
- The optional Side Viewer® Camera System provides four additional Five or ten Mega Pixel Side View Digital Color Cameras for enhanced detection of lifted leads and lifted components.
- This system also provides solder joint inspection of Jleaded and LCC devices
- Precision motion control systems provide absolute reproducibility and repeatability.
- Powerful OCR Engine provides advanced part marking inspection
Software Architecture
- Comprehensive Package Type Library provides simple “Drag and Drop” component programming
- Auto Teaching Tool (ATT) Software provides automatic teaching of component locations using CAD centroid data
- True first article PCB inspection – No “Golden Board” is required
- Global Component Library provides “Automatic Programming” of previously taught components
- True program compatibility with MIRTEC In-line inspection machines
- Off Line Teach Tool (OLTT) Software Option
- Remote Monitoring System displays "Real Time" status of AOI system
- Supports integrated data base management for Remote SPC/Repair through a network server
Improved Powerful Inspection Performance for Lifted Lead Inspection Solution
- New lifted inspection techniques with colour (global patent on process)
- With white LED light/ colour inspection techniques with component gradient
- The best inspection performance for chip/ IC lifted lead defects
Chip Positioning, Solder Ball and Scratch Inspection
- Inspect the component in the correct position, and that its not moved due to vibration, impact or static electricity
- Inspection algorithm for scratches, solder balls and chip misplacement, defects based on frame
- Chip scatter inspection: inspect the chip with incorrect positioning due to vibration, impact or static electricity
- Solder ball inspection: Inspect solder ball defects on the board
- Scratch inspection: Inspect scratches on the pad without solder
Telecentric Lens Application
- Non-distortion during image magnification
- Display the object with the same angle and distance
- No compensation required for the image edge as with a general lens
- Advanced inspection performance when using top camera, as depth and height issues with general cameras are eliminated
Specifications:
PCB area | 50 x 50 ~ 510 x 400 mm * | ||
Inspection PCB thickness | 0.5 ~ 3 mm * | ||
Fov/Resolution | 5 Megapixel | Option 1 | 44.7 x 37.5 mm / 18.2 μm/pixel |
Option 2 | 32.9 x 27.6 mm / 13.4 μm/pixel | ||
Option 3 | 24.1 x 20.1 mm / 9.8 μm/pixel | ||
10 Megapixel | Option 1 | 66.6 x 49.7 mm / 18.2 μm/pixel | |
Option 2 | 49.0 x 36.6 mm / 13.4 μm/pixel | ||
Option 3 | 35.9 x 26.8 mm / 9.8 μm/pixel | ||
15 Megapixel | Option 1 | n.a. | |
Option 2 | n.a. | ||
Inspection speed | 5 Megapixel | Option 1 | 5,986 mm2/sec (0.28sec/frame) |
Option 2 | 3,492 mm2/sec (0.26sec/frame) | ||
Option 3 | 2,028 mm2/sec (0.24sec/frame) | ||
10 Megapixel | Option 1 | 8,977 mm2/sec (0.37sec/frame) | |
Option 2 | 5,299 mm2/sec (0.34sec/frame) | ||
Option 3 | 3,006 mm2/sec (0.32sec/frame) | ||
15 Megapixel | Option 1 | n.a. | |
Option 2 | n.a. | ||
Smallest Component Inspection | Option 1 | 0603 Chip / 0.4 pitch IC (mm) | |
Option 2 | 0402 Chip / 0.3 Pitch IC (mm) | ||
Option 3 | 0402 Chip / 0.3 Pitch IC (mm) | ||
Inspection Item | Lift Component, Lift Lead, Flipped Component, Excessive Solder, Insufficient Solder, Open Solder, Missing Component, Shift, Skew Component, Polarity,Tombstone, Solder Ball, Foreign Component, QFP/BGA Package Flied Component Under The QFP/BGA Package(Laser Option) , Turnover | ||
Options | 3D-Beam® Laser System, Side Viewer®, NG Marker(Mechanic),Barcode, OLTT, INTELLISYS® (Remote SPC, Remote Repair, Remote Management, Remote Debugging), 1D or 2D Guntype Barcode Reader, Intelli-Scan® Laser System, Side Viewer® Camera System, Barcode Reader, Off-Line Teaching Software, INTELLISYS®(Remote SPC, Remote Repair, Remote Management, Remote Debugging), NG Marker(Mechanic Type), 1D or 2D Guntype Barcode Reader, NG Buffer, Turning Conveyor, Loader, Unloader | ||
Top Down Camera | 5 Megapixel | 2,456 x 2,058 Pixels | |
10 Megapixel | 3,664 x 2,736 Pixels | ||
15 Megapixel | n.a. | ||
Lens | Telecentric Lens | ||
Robot Driven System | Closed Loop Stepping System * | ||
Lighting System | 3 Layer LED (Horizontal, Vertical, Coaxial), Quad Angle Lighting System, User defined settings | ||
Laser Sensor | Z-Height Repeating Measurement Accuracy:±20μm (Resolution: 15μm/point) | ||
PC | Intel® Core™ 2 Duo, 19” LCD Monitor, Windows XP Professional | ||
Machine Dimension * | 975(W) x 1,200(D) x 630(H) mm | ||
Weight | 110KG | ||
Power Requirement | Single Phase AC 85~264V, 50/60Hz | ||
Environment | Temperature: 0~40°C, Humidity: 30-80%RH | ||
Please do not hesitate to contact us for any further information.
